With various foundry partners, we provide diversified options of semiconductor manufacturing service to our customers. The available process technologies include: Bipolar, Mixed-Signal 0.6um~0.13um, Logic 3.0um~0.35um, HV CMOS 2.0um~0.13um, Power Management (BCD) 0.35um~0.18um, Embedded NVM 1.5um~0.15um, Flat-cell process 0.35um~0.45um. RFCMOS, SiGe, BiCMOS and CMOS Image Sensor are also obtainable by customer’s request.

We also have well-experienced engineering and logistic teams to help customers on all the detail works and communication with FAB. With our service teams, customers could save more time and resources and focus on their project developing and marketing.